Others

KABRA

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer.

Cutting and Planarization Using a Surface Planer

Surface planners use bit grinding with a diamond bit to realize high-accuracy planarization for ductile materials (Au, Cu, and solder), resin (photoresist, polyimide), and composites of these materials.

Ultrasonic Dicing

Ultrasonic dicing, which was developed as a process to support electric parts (ceramics) and optical parts (optical glass prisms, filters, etc.), improves the processability of difficult-to-process materials including glass and ceramics which are difficult to process using blade dicing.

Plasma Dicing Process

Processing technology that separates wafers into die by performing dry etching under vacuum

Cutting Using a WaterJet Saw

In addition to dicing saw and laser saw applications, DISCO is also proposing various applications based on the waterjet saw (Product name: DAW4110). In the DAW4110, abrasive material, which is discharged from a nozzle together with pressurized water, is used to cut the workpiece.

Glass processing

This is an introduction to our high-precision, high-quality processing technology for products that use crystallized glass, quartz glass, or other types of glass.

ORIMIRROR

A new crystalline orientation identification method using a mirror surface. Maximizes the device area and prevents processing defects caused due to the notch shape.