Product Information
Accessory Equipment
Ultrasonic-wave Dicing Unit
Ultrasonic-wave Dicing Unit
A unit employing a special blade which allows ultrasonic-wave assisted processing
DWR1722
Deionized Water Recycling Unit
Deionized water recycling unit combines the capabilities of producing deionized water, controlling the water temperature, filtering, and waste water treatment in a single unit.
DWR1730
Deionized Water Recycling Unit
Deionized water recycling unit combines the capabilities of producing deionized water, controlling the water temperature, filtering, and waste water treatment in a single unit.
DTU1550
Water Temperature Control Unit
For silicon wafer cutting or electronic components cutting / wheel coolant circulating method
DTU162
Water Temperature Control Unit
For silicon wafer cutting or electronic components cutting / wheel coolant circulating method
CO2 Injector
Resistivity Management Unit
Prevent particle adhesion and device damage caused by static electricity.
DCS1440
Automatic Cleaning System
For silicon wafer, glass board or ceramic workpiece cleaning
DCS1441
Automatic Cleaning System
For silicon wafer, glass board or ceramic workpiece cleaning
DCS1460
Automatic Cleaning System
For silicon wafer, glass board or ceramic workpiece cleaning
CC Filter Unit
Cutting Water Filtration Unit for Dicing Saws
Unique filter design for low filtration running costs
Related Products
StayClean-A
Cutting Water Additives for Dicing
Prevents the particle adhesion and corrosion of the bonding pad
StayClean-F
Cutting Water Additives for Dicing
Prevents the particle adhesion and corrosion of the bonding pad
StayClean-R
Cutting Water Additives for Dicing
Prevents the particle adhesion and corrosion of the bonding pad
StayClean301
Cutting Water Additives for Dicing
Prevents the particle adhesion and corrosion of the bonding pad
StayClean Injector
Dedicated unit for injecting StayClean
StayClean device for advanced concentration control of the additive
HogoMax
Water-soluble Protective Film
Reduces adhesion of debris
Tape Frames
Tape frames hold the wafer or other workpiece during dicing.
Dicing Cassettes
Contains the tape frames and workpieces before and after processing
Grinding Cassettes
Special (double slot) cassette for thin wafers
PRECUTBOARD®
Precutting Tools